Park NX-TSH600
Industry’s leading automated AFM for panel level packaging
NX-TSH600 is an advanced atomic force microscope for seamless integration into semiconductor panel level packaging environments and capable of accurately measuring samples up to 600 mm × 600 mm. Leveraging Park Systems' proven AFM technology, NX-TSH600 delivers reliable nanoscale measurement capabilities with full compliance with SEMI standards and complete automation.
NX-TSH600 is trusted by leading global semiconductor manufacturers and actively deployed in PLP production, with its installed base continuing to grow.
Key Features
Fully Automated Operation
NX-TSH600 enables fully automated operation from panel handling to measurement and analysis. The system automatically receives a recipe from the host, performs end-to-end automation, including selecting the appropriate probe, scanning multiple target areas, analyzing measurement data, and generating reports.
Automated Panel Handling Capability
Panel transfer is performed automatically by an equipment front end module (EFEM). It uses robotic mechanisms, sensors, and algorithms to ensure precise
alignment and reliable handling of various materials, including warped panels.
Automatic Probe Exchange
The automatic tip exchanger seamlessly replaces the probe when the threshold is exceeded. It can store up to 24 pre-mounted probes (12 probes per cassette).
Equipment Front End Module (EFEM)
NX-TSH600 is equipped with an EFEM featuring dual load ports and a dual arm robot for efficient panel handling. The pre-aligner precisely positions samples at the center and rotates them to the desired angle, while ID readers recognize sample IDs to determine the type and orientation of each sample. An automated flipper enables AFM measurements on both the front and back sides of the panel.
Sample Chuck for Panel Samples
The sample chuck is composed of a ceramic cell with evenly distributed pores, enabling uniform vacuum application across the entire surface to securely hold large PLP samples.
Off-axis Optics for Panel Alignment
NX-TSH600 is equipped with off-axis optics featuring a 0.8× objective lens for easy identification of fiducial marks across wide PLP sample areas. The on-axis optics with a 10× objective lens enables zoomed-in views of fine sample patterns, allowing quick and precise identification of desired measurement locations.
Off-axis Optics (w/ 0.8× objective lens)
On-axis Optics (w/ 10× objective lens)
Easy-to-Use Operation Software XEA
XEA offers practical features such as easy copy/paste of recipes, specialized editing modes, and real-time recipe updates. With built-in functions providing comprehensive system operation—including parameter adjustment, database management, and maintenance—the interface remains straightforward and user-friendly. The navigator provides an intuitive user interface that integrates system adjustment and operation.
Fab Host Communication via SECS/GEM Protocol
The system enables Fab host communication via the SECS/GEM protocol, ensuring full compliance with SEMI standards including E30, E40, E87, E90, E94, and E84 PI/O for AMHS integration.
Park AFM Technology
Tip Scanning Head (TSH) System
The sample is secured on the chuck while the gantry-mounted tip scanning head moves to desired measurement positions on the sample surface. This tip scanning approach eliminates sample size and weight limitations. The tip scanning head features a fully decoupled XY scanner and Z scanner, enabling precise control in each direction.
Decoupled XY and Z Scanner System
The separated flexure-guided 2D XY scanner and 1D Z scanner system minimizes
out-of-plane motion by eliminating crosstalk between horizontal and vertical motion. The independent Z scanner enables precise, linear, and fast dynamic performance.
Park AFM Technology
True Non-Contact™ Mode
True Non-contact™ mode, a proprietary technology offered by Park Systems, obtains topography by detecting the attractive van der Waals force between the tip and sample surface. The key advantage of True Non-contact mode is the prevention of tip wear and sample damage, ensuring consistent results with superior data reliability. This also reduces the total cost of ownership by extending tip life.
Versatile Applications
Comprehensive 3D Nano-Metrology
Park AFM precisely measures width (critical dimension), pitch, height (depth), taper angle (side wall angle), and surface roughness.
- Width (CD) & Pitch
- Height (Depth)
- Taper Angle (Side Wall Angle)
- Surface Roughness
Roughness Measurement for Various Panels in PLP
NX-TSH600 is used for surface roughness measurement in Panel Level Packaging (PLP) process. The PLP process uses samples of various thicknesses and materials. Measuring the surface roughness of each sample is essential to improving and managing adhesion across a wide range of samples.
- Scan Size: 40 µm × 40 µm
- Resolution: 1,024 pixels × 128 lines