Copper foil
Metals & Ceramics
The copper foil sample, fabricated using a hot embossing technique, was characterized in True Non-contact mode. The scan image reveals a cauliflower-like surface topography with a peak-to-valley height of about 4.2 µm.
Scanning Conditions
- System: NX-Hivac
- Scan Mode: True Non-contact™ mode
- Scan Rate: 0.5 Hz
- Scan Size: 40 nm × 40 nm
- Pixel Size: 512 × 512 pixels
- Peak-to-valley: 4.2 µm
Application
Related Products
Related Modes
True Non-Contact™ Mode
Related Contents
System Webinars
Solving Thin-Film Uniformity Challenges on Curved Surfaces with Imaging Spectroscopic Ellipsometry
System Webinars
AFM Augmented Sample Fabrication for Next-Generation Layered Materials Devices
System Webinars
Advanced Methods for Research into Ferroelectric Materials and Superlattices
×