Defect on PR Patterns
SEM inspection of soft photoresist (PR) patterns provides only contrast information and may cause beam-induced shrinkage, charging, or profile distortion.
True Non-contact AFM delivers non-destructive, high-resolution 3D topography with accurate nanometer-scale defect height measurement.
Scan Conditions
- System: NX-Wafer
- Scan Mode: Non-contact
- Scan Size: 200 nm×200 nm
- Scan Rate: 0.3 Hz
- Pixels: 512×512
- Cantilever: AC160TS (k=26 N/m, f=300 kHz)
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