Cu Pad Wafer
Fast imaging contact mode (FiCM) enables rapid, high-throughput measurement of Cu pad arrays across the wafer, providing reliable pad height and uniformity data at multiple positions.
Scan Conditions
- System: NX-Wafer
- Scan Mode: FiCM
- Scan Size: 5 µm×5 µm
- Scan Rate: 20 Hz
- Pixels: 1024×128
- Cantilever: biosphere B50-CONT
(k=0.2 N/m, f=13 kHz)
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