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    Wafer Series
    AFM Specifications
 

Park NX-Wafer Specifications

System
Specification

Motorized XY stage

200mm : travels up to 275 mm × 200 mm, 0.5 µm resolution

300mm : travels up to 400 mm × 300 mm, 0.5 µm resolution, 1 µm repeatability


Motorized Z stage

25 mm Z travel distance,
0.08 µm resolution, < 1 µm repeatability

Motorized Focus Stage

9 mm Z travel distance for on-axis optics


Sample Thickness Allowance

up to 20 mm


Full scan range Z run-out

< 2 nm, repeatability < 1nm


COGNEX Pattern Recognition

pattern align resolution of 1/4 pixel

 

Scanner Performances

XY Scanner

100 µm × 100 µm (Large mode)
50 µm × 50 µm (Medium mode)
10 µm × 10 µm (Small mode)
Single-module flexure XY scanner with closed-loop control


XY Scanner Resolution

0.15 nm (Large mode)

Z Scanner Range

15 µm (Large mode)
2 µm (Small mode)

Z Scanner Resolution

0.016 nm (Large mode)
0.002 nm (Small mode)

Z Scanner Detector Noise

0.02 nm @ 1kHz

 

AFM and XY Stage
Control Electronics

ADC

18 channels
4 high-speed ADC channels
24-bit ADCs for X,Y and Z scanner position sensor

 

DAC

12 channels
2 high-speed DAC channels
20-bit DACs for X,Y and Z scanner positioning

 

Compliances

CE

SEMI Standard S2/S8

 

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration

< 0.5 µm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)

Acoustic Noise

>20 dB attenuation w/ Acoustic Enclosure

 

Facility Requirements

Room Temperature (Stand By)

10 °C ~ 40 °C 


Room Temperature (Operating)

18 °C ~ 24 °C


Humidity

30% to 60% (not condensing)


Floor Vibration Level

VC-E (3 µm/sec)


Acoustic Noise

Below 65 dB

Pneumatics

Vacuum : -80 kPa
CDA (or N2): 0.7 MPa


Power Supply Rating

208V - 240 V, single phase, 15 A (max)


Total Power Consumption

2 KW (typical)


Ground Resistance

Below 100 ohms

 

Options

Long Range Profiler

Less than ±5 nm out-of-plane motion over 10 mm scan.

 

Automatic Tip Exchange (ATX)

Automatic Tip Exchange performs fully automated tip exchanges in order to seamlessly continue automated measurement routines. It automatically calibrates cantilever location and optimizes measurement settings based on measurements of a reference pattern. Our novel magnetic approach to the tip exchange yields a 99% success rate, higher than the traditional vacuum techniques.

 

Automatic Wafer Handler (EFEM or FOUP)

The XE-3DM can be further customized by adding an automatic wafer handler (EFEM or FOUP or other). The high-precision, nondestructive wafer handler robot arm fully ensures XE-3DM users to receive fast and reliable wafer measurement automation.

 

Ionization System

Ionization system effectively removes electrostatic charges. It ionizes the charged objects and is very reliable since the system always generates and maintains an ideal balance of positive and negative ions without causing any contamination to the surrounding area. It also reduces the accidental electrostatic built-in charge that may occur during sample handling.

 

Dimensions & Weight

200 mm System

2732 mm(w) × 1100 mm(d) x 2400 mm(h)
w/ EFEM, 2110 kg approx. (incl. Control Cabinet)


Ceiling Height

2000 mm or more


Operator Working Space

3300 mm (w) x 1950 mm (d), Minimum

300 mm System

3486 mm(w) × 1450 mm(d) x 2400 mm(h)
w/ EFEM, 2950 kg approx. (incl. Control Cabinet)


Ceiling Height

2000 mm or more


Operator Working Space

4770 mm (w) x 3050 mm (d), Minimum

 
footprint-300mm-wafer[ Park NX-Wafer 300mm installation layout ]
 

Park Wafer - Specifications | Park Atomic Force Microscope