软电子学正在向医疗保健监测和医疗植入方向发展。然而,材料的高导电性和低杨氏模量之间难以达到平衡、生物组织与柔性智能器件之间较差的粘合强度和显著的机械失配等因素会导致器件在界面上的功能失效。在此,我们报告了一种具有低模量(56.1-401.9 kPa)、高拉伸性(700%)、高界面附着力(搭接剪切强度>1.2 MPa)和高导电性(1-37 S/cm)的自粘附导电聚合物,并可用于可穿戴柔性生物电子设备中对肌电信号进行可视检测。
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