SPECIFICATIONS

System Specification

200mm Motorized XY stage : travels up to 275 mm × 200 mm, 0.5 μm resolution
300mm Motorized XY stage : travels up to ~375 mm × 300 mm, 0.5 μm resolution, < 1 μm repeatability
Motorized Z stage : ~30 mm Z travel distance, ~0.08 μm resolution, < 1 μm repeatability
Motorized Focus Stage : 11 mm Z travel distance for on-axis optics
Motorized Angle Range : -19 degree and +19 degree, -38 degree and +38 degree, < 0.5 degree angle repeatability
Sample Thickness Allowance : up to 20 mm
Full scan range Z run-out : < 2 nm, repeatability < 1 nm
COGNEX Pattern Recognition : pattern align resolution of 1/4 pixel

Scanner Performances

XY Scanner Range : 100 μm × 100 μm (large mode), 50 μm x 50 μm (medium mode), 10 μm × 10 μm (small mode)
XY Scanner Resolution : 1.5 nm (high voltage mode), < 0.2 nm (low voltage mode)
Z Scanner Range : 12 μm (high voltage mode), 1.7 μm (low voltage mode)
Z Scanner Resolution : < 0.2 nm 

AFM and XY Stage Control Electronics

Controller Processing Unit : 600 MHz and 4800 MIPS
Signal ADC & DAC : 16-bit, 500 kHz bandwidth, internal lock-in

Vibration, Acoustic Noise, and ESD Performances

Floor Vibration : < 0.5 μm/s (10 Hz to 200 Hz w/ Active Vibration Isolation System)
Acoustic Noise : >20 dB attenuation w/ Acoustic Enclosure

Facility Requirements

Room Temperature (Stand By) : 10 °C ~ 40 °C
Room Temperature (Operating) : 18 °C ~ 24 °C
Humidity : 30% to 60% (not condensing)
Floor Vibration Level : VC-E (3 μm/sec)
Acoustic Noise : Below 65 dB
Pneumatics : Vacuum : -80 kPa
CDA : 0.7 Mpa
Power Supply Rating : 208~240V, single phase, 15A (max)
Total Power Consumption : 2 KW (typical)
Ground Resistance : Below 100 ohms

Dimension & Weight

200mm System : 880(w) × 1050(d) × 2024(h) w/o EFEM, 800 kg approx. (incl. XE-3DM main body)
                                1820(w) × 1050(d) × 2024(h) w/ EFEM, 1010 kg approx. (incl. XE-3DM main body)
Control Cabinet : 800(w) × 800(d) × 1000(h), 160 kg approx. (incl. controllers)
                                 600(w) x 800(d) x 2000(h) tower type, 220 kg approx. (incl. controllers)
System Floor Space : 1780(w) × 980(d) w/o EFEM
System Floor Space : 3050 (w) × 980 (d) w/ EFEM
Ceiling Height : 2000 or more
Operator Working Space : 3300(w) x 1950(d), minimum (dimension unit: mm)

300mm System : 1220(w) × 1200(d) × 2024(h) w/o EFEM, 1150 kg approx. (incl. XE-3DM main body)
                                 2490(w) × 1720(d) × 2024(h) w/ EFEM, 1450 kg approx. (incl. XE-3DM main body)
Control Cabinet : 800(w) × 800(d) × 1000(h), 160 kg approx. (incl. controllers)
                                 600(w) x 800(d) x 2000(h) tower type, 220 kg approx. (incl. controllers)
Wafer Handler (EFEM) : 1270(w) x 1720(d) x 2024(h), 300 kg approx
System Floor Space : 1220(w) × 1200(d) w/o EFEM
System Floor Space : 2490 (w) × 1720 (d) w/ EFEM
Ceiling Height : 2000 or more
Operator Working Space : 4500(w) x 3120(d) (dimension unit: mm)

Software & User Interface

XEA - Industrial Automation & Analysis

XEA is a system software for automation that carries out the AFM measurement of a sample following the preset procedure written in a recipe file. User-friendly XEA architecture provides flexibility to operator to perform various system-wide functions.
 
• Supports auto, semi-auto, and manual mode
• Editable measurement method for each automated procedure
• Live monitoring of the measurement process
• Automatic analysis of acquired measurement data

XEP – Data Acquisition

All the user controls on AFM measurements are operated through XEP, the data acquisition program. The user-oriented interface provides easy operation of AFM.
 
• Simultaneous data acquisition of up to 16 images
• Maximum 4096 × 4096 image size
• Dedicated Force-distance and I-V spectroscopy with batch processing
• Cantilever spring constant calibration
• Script-level control through external program (LabVIEW, C++)

XEI – Image Processing and Analysis

XEI is the AFM image processing and analysis program. The powerful processing algorithms make the analysis easy and streamlined. With its most advanced and versatile imaging features, XE users can obtain essential and critical information from their experiment.
 
• Image analysis of line profile, region, 3D rendering
• Spectroscopy data analysis module (F-d, I-V)
• Directly copy/paste to presentation program
• Multiple image comparison
• Image overlay of two different images

Options

Automatic Tip Exchange (ATX)

Automatic Tip Exchange performs fully automated tip exchanges in order to seamlessly continue automated measurement routines. It automatically calibrates cantilever location and optimizes measurement settings based on measurements of a reference pattern. Our novel magnetic approach to the tip exchange yields a 99% success rate, higher than the traditional vacuum techniques.

Automatic Wafer Handler (EFEM or FOUP)

The XE-3DM can be further customized by adding an automatic wafer handler (EFEM or FOUP or other). The high-precision, nondestructive wafer handler robot arm fully ensures XE-3DM users to receive fast and reliable wafer measurement automation.

Ionization System

Ionization system effectively removes electrostatic charges. It ionizes the charged objects and is very reliable since the system always generates and maintains an ideal balance of positive and negative ions without causing any contamination to the surrounding area. It also reduces the accidental electrostatic built-in charge that may occur during sample handling.