3D Nanoscaffold Cantilevers for Potential Applications in High Speed Wafer Scale Imaging
Speaker : Hoa Le Affiliation : Rowland Institute at Harvard Region : US Year : 2019 Language : English Delve into the realm of 3D Nanoscaffold Cantilevers, an engineering project with potential applications in high-speed wafer-scale imaging. Uncover the intricacies of designing these cantilevers, addressing challenges in high-frequency oscillation and tip wear. Explore the metamaterial concept, pushing the boundaries of cantilever performance for advanced AFM applications.
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