TSV Cu pad oxidation

Scanning Conditions
- System: NX-Wafer
- Scan Mode: True Non-Contact™ Mode
- Scan Rate: 1 Hz
- Scan Size: 40 µm×40 µm
- Pixel Size: 512×512
- Cantilever: OMCL-AC160TS (k=26 N/m, f=300 kHz)
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