300 mm Wafer Edge
NX-Wafer Plus provides in-line 360° AFM edge profiling with a rotation stage, enabling continuous, high-resolution measurements of the 300 mm wafer edge at > 0.1° intervals.
Line profile measurements across the wafer perimeter reveal localized, position-dependent morphology variations for reliable edge process monitoring.
Scan Conditions
- System: NX-Wafer Plus with Sample Rotation Stage
- Scan Mode: Non-contact
- Scan Size: 40 mm
- Scan Speed: 2 mm/sec
- Pixels: 4000×1 per Position
- Cantilever: CDT-NCHR (k=80 N/m, f=400 kHz)
Application
Related Modes
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