-
SrTiO3 ElectroChemical Array DNA Ceramics Electical&Electronics Dr.JurekSadowski Chromium Silicon Electronics EFMAmplitude P3HT MagneticForce ULCA SiliconeOxide VinylAlcohol Piezoelectric PECurve Reading Laser C_AFM lift_mode BreastCancerCell AEAPDES medical Leakage UnivMaryland PrCurve dielectric_trench #Materials AAO LightEmission Al2O3 UnivCollegeLondon organic_polymer
Report image
If you found this image unacceptable, please let us know. We will review your report and take action if we determine this image is really unacceptable.
TSV Cu pad oxidation
Scanning Conditions
- System : NX-Wafer
- Scan Mode: Non-contact
- Scan Rate : All 1 Hz
- Scan Size : 40μm×40μm
- Pixel Size : All 512×512
- Cantilever : OMCL-AC160TS (k=26N/m, f=300kHz)