| 고객문의   Global

2022 ISPSA Header

ISPSA 2022 가 2022년 7월 17일부터 21일까지 제주 라마다 플라자 호텔에서 "Past-, Current-, and Future-Semiconductors"를 주제로 개최됩니다.

파크시스템스는 ISPSA 2022에 참가하여 우수한 원자현미경 기술과 제품을 소개하며, 특별히 7월 21일(목) 조상준 전무이사의 Invited Talk 이 예정되어 있습니다.

일정: 2022년 7월 18일(월) - 21일(목)

장소: 제주 라마다 플라자 호텔

발표: 7.21(목) 11:30-12:00 "The Potential of Inline Automated Defect Review of Mechanical Property and Electrical Characterization by AFM" (by Dr. Sang-Joon Cho)

 

ABSTRACT

The Potential of Inline Automated Defect Review of Mechanical Property and Electrical Characterization by AFM

S.-J. Cho1*, S.-O. Km1, M. Lee1, Y.K. Lee1

1Application Technology Center, Park Systems Corp., Suwon, Korea

*Email: msjcho@parksystems.com

With decreasing device sizes, nanometer-sized defects on the wafer substrates can already limit the performance of the devices. The detection and precise classification of these defects requires additional characterization methods with a resolution in the nanometer-range. It is well known that AFM can measure not only surface morphology but also mechanical and electrical properties. However, the versatility of AFM is not fully utilized in industrial applications due to the various limitations. Various limitations include low throughput and tip life in addition to the laborious efforts for finding the defects in inline automated defect review (ADR). In this paper we introduce the ADR AFM with mechanical and electrical characterization capability of defects in addition to high throughput, high resolution, and non-destructive means for obtaining 3D information for nm-scale defect review and classification. This paper also introduces the potential application of the electrical characterization of ADR eventually leading to failure analysis. The advanced automated process and AFM-based physical property measurements enable ADR AFM to complement any manufacturing control toolset and easily accommodates wafer inspected by various inspection tools

This work was supported by National Grants of the Technology Innovation Program (20017507, Development of Metrology Inspection system for Semiconductor process based on Inline AFM and 20019223, Developing Automated Mask Repair Technology with EUV MASK Detec Detection and Analysis) funded By the Ministry of Trade, Industry & Energy (MOTIE, Korea) to S.-J. Cho.

References

[1] Zandiatashbar, A., Kim, B., Yoo, Y. K., Lee, K., Jo, A., Lee, J. S., Cho, S.-J., and Park, S. I., In Metrology, Inspection, and Process Control for Microlithography XXIX International Society for Optics and Photonics. March 2015, Vol. 9424, pp. 94241X.

[2] Zandiatashbar, A., Kim, B., Yoo, Y. K., Lee, K., Jo, A., Lee, J. S., Cho, S.-J., and Park, S. I., Photomask Technology 2015. International Society for Optics and Photonics, October 2015. pp. 96351A.

[3] Zandiatashbar, A., Taylor, P. A., Kim, B., Yoo, Y. K., Lee, K., Jo, A., Lee, J. S., Cho, S.-J., and Park, S. I, Metrology, Inspection, and Process Control for Microlithography XXX. International Society for Optics and Photonics, March 2016. pp. 97782P.

[4] Butt, Hans-Jürgen, Brunero Cappella, and Michael Kappl. Surface science reports 59.1-6 2005, pp1-152.

 

Linkhttps://www.ispsa.or.kr/