From October 1 to 5 2018 the 29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF 2018, will be held in Aalborg, Denmark.
Park Systems is proud to announce its participation as an exhibitor!
This international symposium will continue its almost 30-year history of focusing on the latest research developments and future directions in failure analysis, quality and reliability of materials, devices and circuits for micro-, opto-, power and space electronics. It historically provides an unpaired European forum to develop all aspects of reliability, including management and advanced analysis techniques for present and emerging semiconductor applications. Hence, all aspects of specification, technology and manufacturing, test, control and analysis will be addressed.
Step by our booth #14 to learn about the latest AFM technological advances for failure analysis and electronic devices.
- Event Dates: October, 1-5, 2018
- Venue 1: AKKC - Aalborg Kongres & Kultur Center, Denmark
- Our location : booth #14
Join our talk on "Automatizing Atomic Force Microscopy – Newest technological solutions in advanced applications for failure analysis" on:
- Industrial Session, Tuesday, October, 2, 9:20am
About ESREF:
The European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, ESREF, is the annual forum for reliability physics and analysis of electronic components in Europe. The Copenhagen event is the 9th conference in the series. In 1991 ESREF merged with the International Conference on Quality in Electronic Components, Failure Prevention, Detection and Analysis. It now merges with the European EOBT Conference on Electrical and Optical Beam Testing. The ESREF conferences are seen to target a very broad cross section of research in the fields of electronic component reliability and failure analysis, and each year an increasing numbers of papers and participants from all over the world contribute to making this a truly international event. Whilst the major emphasis is on silicon integrated circuits, there are sessions devoted to also compound semiconductor reliability and optoelectronic devices, to packaging techniques, and, for the first time a session is given to a new major growth area, MEMS, or microelectromechanical systems.
Link: http://www.esref2018conf.org/index.php?n=GeneralInformation.Home/a>