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Park Systems, the leading nanotechnology solutions partner of nanoscale measurements, invite you to visit us at SEMICON WEST 2012 (Booth #1346), July 10th - 12th 2012 at the Moscone Center in San Francisco, CA USA. Park, in its continuing efforts to provide our customers with metrology characterization solutions for today’s challenges in device manufacturing, will be featuring a range of industrial AFM products for in-line inspection in wafer manufacturing. The capabilities of our featured systems range from critical dimension measurement to undercut and sidewall characterization. SEMICON West will provide an excellent opportunity to learn about the XE-Wafer, our automated industrial AFM for in-line wafer inspection and metrology of 200 and 300 mm wafers, and the XE-3DM, our new 3D AFM for high resolution 3D metrology with patented tilted Z-scan system. The XE-3DM is a breakthrough in high resolution imaging of deep undercut structures and sidewalls. In addition, our True Non-Contact Mode enables non-destructive measurement of soft photoresist surface with high aspect ratio tips. Come and discover Parks’ fully automated AFM solutions for process monitoring and characterization of critical topographies!