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We are pleased to be a part of SEMICON EUROPA 2019 – THE event for electronics manufacturing in Europe.

Step by our booth B1-666 and learn more about significant technological advances from Park Systems dedicated to Semiconductor and Hard Disk markets, Semiconductor Manufacturing Failure Analysis, Wafer-Fab Manufacturing and more.

Come and join our Luncheons every Semicon day at 12:00 am.

Enjoy the lunch snacks and the seminar on: "Detect the defect! - on Advantages of Automated Atomic Force Microscopy [AFM] for Semiconductor Applications,” presented by Dr. Christian Froeck every Semicon day at 12:00.

Banner Luncheon

Abstract

Detect the defect

Advantages of Automated Atomic Force Microscopy [AFM] for Semiconductor Applications

Surface investigation is useful to improve yield and quality of semiconductor products. In particular, the detection and characterization of defects play an important role for optimizing production processes. Automatic Defect Review Atomic Force Microscope (ADR AFM) from Park Systems is a tool for inline or offline wafer inspection to generate three dimensional (3D) images of defects.

Conventional optical instruments, like Automated Optical Inspection (AOI) systems, allow a higher throughput but cannot provide the resolution, which is necessary for the inspection of today’s semiconductor structures. Since AOI is restricted by the diffraction limit, ADR AFM complements it by capability of characterizing features in the range of several nanometers.

Furthermore, the ADR AFM provides 3D information of defects which cannot be given by optical or other methods like SEM. The True Non-ContactTM measuring mode, available on Park’s ADR AFM, enables the non-destructive surface characterization of the semiconductor (contrary to SEM) ensuring the long tip lifetime without the necessity of exchanging the probe. In addition to the defect review capabilities, the ADR AFM from Park Systems functions as a conventional AFM to obtain 3D information of semiconductor structures. Surface roughness, trench depth, via or bump analysis can be measured inline during the production, or offline in a metrology laboratory. The data received can be used to optimize production processes and to qualify process steps.

SEMICON 2019 coordinates:

  • Time: November 12 – November 15 2019
  • Venue: Neue Messe München, Munich, Germany
  • Booth: #B1-666

About the SEMICON tradeshows:

The Semicon Europa is Europe's leading showcase for technologies that are at the cutting edge of the microelectronics industry and highlights the areas of research and development. As an information and communication platform it offers high-caliber technical conferences, forums and programs and excellent networking opportunities.

Linkhttp://www.semiconeuropa.org/

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