ICPT (International Conference on Planarization/CMP Technology),is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely. Park Systems will attend ICPT 2019 as the diamond sponsor, and Prof. Tae-gon Kim will give an invited talk for 25 mins during the conference. Prof. Kim is a professor at Hanyang University, Korea. His background is cleaning and CMP. During the invited talk, he will talk about the CMP applications by using Park AFM.
Prof. Tae-gon Kim, Hanyang University, Korea
- Date : September 15(SUN)-September 18(WED) , 2019
- Venue : Ambassador Hotel, Hsinchu, Taiwan
About ICPT 2019 :
CMP (chemical mechanical planarization), as one of the most important processes in the semiconductor manufacturing, has been developed and improved continuously year after year. It has built a certain position in related industries, and is expanding in its applied area. From the user's point of view, technical demand is becoming higher and higher, and additional applications beyond the semiconductor area are increasing.
ICPT (International Conference on Planarization/CMP Technology), is a magnificent opportunity to have discussions on CMP technologies, including FEOL and BEOL CMP, Fundamentals of CMP, Polishing Processes, Consumables, Equipment, 3D/TSV, Metrology, Cleaning, Defect Control, Process Control, etc. The conference provides a place where every relevant researcher and engineer can get together to discuss openly and exchange information widely.
